PVD Products has booked an order for a second turn-key combinatorial sputter deposition system. This system is designed for 100 mm diameter wafers and uses smaller 1" targets. This system is scheduled to ship in May 2011.

PVD Products has installed a turn-key combinatorial sputter deposition system for 300 mm diameter wafers in a major semiconductor fab. This system includes four PVD Products Titan in-situ tiltable magnetron sputter sources mounted on motorized Z-stages. Each source is connected to both an RF and DC power supply through a programmable RF/DC switch. The 300 mm wafer is transferred to a wafer holder mounted to a vacuum compatible X-Y stage with 1 micron positioning resolution. Co-sputtering from up to four sources through a metal mask creates a well defined pad on the wafer. Using the X-Y stage to step location and using the sources at different power levels and/or varying target to substrate distances allows the deposition of a wide range of varying material compositions in a computer controlled fashion. This system is also mated to a central robot wafer handler.