Custom Deposition Systems

Even with the wide variety of deposition technologies and systems available, certain advanced research or proprietary production recipes demand customized deposition systems. PVD is committed to collaboration and to building systems to meet our customers’ specific needs. Drivers for customization can include:

  • Substrates, sources and targets
  • Variety of coatings required
  • Complexity of coatings required
  • Need for multiple deposition methods
  • Space limitations
  • Existing technology integration
  • Coating run frequency

Our engineering team will work with you to develop your requirements and design a system that precisely meets your research or production needs.

Pulsed Laser Deposition (PLD)

PLD systems use a laser beam to vaporize a solid target material in order to produce a thin film with exactly the same chemical composition as the original target material. The PLD process enables the deposition of many complex materials over a wide range of background gas compositions and pressures. Many types of lasers, including ps and fs lasers, can be utilized.

Alternative techniques such as Matrix Assisted Pulsed Laser Evaporation (MAPLE) and Resonant IR Pulsed Laser Evaporation systems are available with appropriate lasers. PVD Products offers a wide variety of PLD systems for substrates ranging in size from 5 mm square up to 200 mm in diameter. We also can provide PLD systems for roll-to-roll applications.

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Sputtering Deposition

Sputtering systems use a plasma to generate positive ions that collide with the target, dislodging material. The resulting vapor condenses onto the substrate, creating a thin film. PVD Products manufactures complete integrated sputtering systems to meet customers’ specific deposition requirements. Available technologies include magnetron, ion-beam, and combinatorial sputtering. The sputtering chamber may be fitted with additional ports for diagnostic tools such as Residual Gas Analysis (RGA), Reflection High-Energy Electron Diffraction (RHEED), ellipsometry, or Multi-Beam Optical Sensors (MOSS) for in-situ stress measurement. A wide range of magnetron source options are available including RF, DC, and pulsed DC magnetrons for metallic or reactive sputtering targets, in-situ tilt, and target sizes ranging from 25 mm to 100 mm in diameter. Substrate stages for wafers up to 300 mm in diameter are available with heating to 850°C.

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Evaporation Deposition

Evaporation systems use direct heat to vaporize the metallic source material. PVD Products offers a range of evaporation techniques to meet customers’ specific deposition needs, including Glancing Angle Incidence Deposition (GLADS), Ion Beam Assisted Evaporation, and thermal evaporation. These systems can contain single or multiple thermal sources, multi-pocket e-beam sources, and multi-gun sources as required. Linear e-beam sources are also available.

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Chemical Vapor Deposition

Chemical Vapor Deposition (CVD) uses vaporized molecular precursors to bond thin film coatings onto a substrate. CVD is particularly useful when coating unusual sizes and shapes or when working with heat-sensitive materials. PVD Products offers both standard CVD and Plasma-Enhanced Chemical Vapor Deposition (PECVD).

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Want to explore more of PVD’s thin film deposition systems and customization options?

Download the PVD eBook:

Choosing a Thin Film Deposition System

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Customers Say

Gin Jose | University of Leeds

"PVD is the best in the business for customization. Other suppliers don’t have the expertise to build custom."

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Still have questions?

Learn more about thin film deposition from our team of experts by reading our FAQs.

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