Sputtering Systems

PVD Products manufactures sputtering systems for depositing metal and dielectric thin films on substrates up to 300 mm in diameter. An array of magnetron sputtering sources, using RF, DC, HiPIMS, or pulsed DC power, are operated singly or in co-deposition mode to produce a wide variety of film compositions.

Our magnetron sputtering sources range in size from 1 inch (25 mm) to 8 inches (200 mm) in diameter with options such as in-situ tilt for fine adjustments of the deposition profile. Substrate stages for wafers up to 300 mm in diameter are available with heating to 850°C and RF bias.

The sputtering chamber may be fitted with additional ports for diagnostic tools such as a Residual Gas Analysis (RGA), Reflection High-Energy Electron Diffraction (RHEED), Optical Emission Spectrometry, or Ellipsometry.

 
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Magnetron Sputtering Systems

PVD Products manufactures complete integrated sputtering systems to meet your specific deposition requirements. These systems can be configured with multiple RF and/or DC magnetron sources ranging in size from 1 inch (25 mm) to 8 inches (200 mm) in diameter. We can provide systems to handle wafers up to 300 mm in diameter.

Each system is engineered for high uniformity, repeatability, and process flexibility, supporting both R&D and scalable production environments. Modular architectures enable future upgrades and process expansion, while advanced control and automation options ensure precise deposition control and efficient operation across a wide range of materials and applications.

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Sputtering System Options

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Magnetron Sputtering Sources

PVD Products manufactures a wide variety of HV and UHV magnetron sputtering sources for various target sizes. The Titan Magnetron sputtering sources range from 1 inch to 6 inches in diameter.  These sources can be baked to 200°C with the magnets in place. Titan Magnetron magnetic field design provides excellent film uniformity and target utilization.

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Substrate Heaters

PVD Products has designed substrate heaters for various vacuum applications based on all types of heating elements, including IR lamps, Inconel sheathed resistance heaters, PBN-coated graphite heaters, resistive wires such as platinum, molybdenum, tantalum, and tungsten, as well as electron beam bombardment heaters. We can design heaters of various sizes and shapes that work in a variety of different background gasses, including oxygen, over a wide pressure range.

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Facing Magnetrons

PVD Products can provide facing magnetrons for low energy impact sputtering on delicate substrate surfaces. The photo depicts a set of facing magnetrons with four distinct magnetron heads.  These heads can rotate via computer control and provide for multi-layer film growth. Systems with multiple heads are readily available per your requirements.  

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DC and RF Switches

PVD Products offers a full line of DC/DC switch boxes that allow the user to direct the power from a single DC power supply to one of up to six different magnetron sputter sources. This provides reduced system cost as fewer power supplies are required for multilayer film growth.

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Combinatorial Sputtering Systems

PVD Products' combinatorial sputtering systems are used for growing multiple individual thin film test pads, each with a unique composition in a rectangular array onto substrates up to 300 mm in diameter. Each individual test pad has a uniform composition over the test pad area, as opposed to combinatorial systems with films grown using continuous compositional gradients.

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Sputtering Deposition Tools

Sputtering deposition tools are critical for producing high-quality thin films with precise control over composition, thickness, and uniformity. Using physical vapor deposition (PVD) techniques, these systems eject material from a solid target and deposit it onto a substrate, enabling the fabrication of advanced coatings and functional layers across a wide range of applications.

PVD Products sputtering tools support both RF and DC magnetron configurations, making them suitable for conductive, non-conductive, and compound materials. Configurable chamber designs, target sizes, and source arrangements allow processes to be tailored for research, development, and scalable production environments.

With modular architectures, advanced automation, and robust process control, PVD Products sputtering tools are trusted by leading institutions and manufacturers in semiconductor, photonics, energy, MEMS, and advanced materials markets. Each system is built to evolve with your process needs, ensuring long-term performance, scalability, and investment protection.

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Sputtering Components

Sputtering components are essential for enabling stable, repeatable thin-film deposition with precise control over film quality, uniformity, and performance. These components form the core building blocks of physical vapor deposition (PVD) systems, supporting efficient material transfer from sputtering targets to substrates for advanced coating and device fabrication applications.

PVD Products sputtering components include RF and DC magnetron sources, sputtering guns, substrate heaters, shutters, and switches, supporting conductive, non-conductive, and compound materials. Available in multiple sizes and configurations, these components can be tailored to specific chamber designs, process requirements, and research or production environments.

Each PVD Products component is engineered for long-term reliability and seamless integration, helping protect performance, scalability, and investment.

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Sputtering Deposition Equipment

Sputtering deposition equipment from PVD Products delivers precise, repeatable thin-film deposition for advanced research and production applications. Built on proven physical vapor deposition (PVD) technology, these systems enable accurate control of film thickness, composition, and uniformity across a wide range of materials and substrates.

PVD Products sputtering deposition equipment supports RF and DC magnetron sputtering and can be configured with multiple source sizes, chamber geometries, and substrate handling options. Designed for flexibility and scalability, these systems serve semiconductor, photonics, energy, MEMS, and advanced materials markets, providing long-term reliability, process consistency, and investment protection.

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Sputtering Deposition Services

Our sputtering deposition demonstration services provide advanced thin film solutions for research and production applications, utilizing state-of-the-art magnetron sputtering technology. Our flexible systems can run sources individually or in co-deposition mode, enabling precise control over film composition and properties. With magnetron sources ranging from 1 inch to 8 inches in diameter and substrate heating capabilities up to 850°C, we deliver the versatility needed for complex material development and high-performance coating applications.

Whether you require standard depositions or specialized configurations, our capabilities extend from combinatorial sputtering for materials discovery to off-axis and facing magnetron setups for delicate substrates. From initial research and development through pilot production, our sputtering deposition demonstration services are backed by deep technical expertise and a commitment to helping you achieve your thin film objectives.

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Frequently Asked Questions 

What substrate sizes can PVD Products' Sputtering Systems accommodate?
PVD Products manufactures sputtering systems that can handle substrates and wafers up to 300 mm (12 inches) in diameter. Our substrate stages are designed to accommodate various sizes, from small research samples to large-format wafers used in semiconductor and materials research applications.
What types of thin films can be deposited using magnetron sputtering?

Our magnetron sputtering systems can deposit a wide variety of materials including metals, dielectrics, oxides, nitrides, semiconductors, ferromagnetic materials, and complex oxide compositions. The versatility of our systems allows for single-layer films, multilayer structures, and co-deposited alloy compositions depending on your specific application requirements.

What is Magnetron Sputtering and how does it work?

Magnetron sputtering is a physical vapor deposition (PVD) technique used to deposit thin films onto substrates. The process involves creating a plasma in a vacuum chamber that bombards a target material, causing atoms to be ejected and deposited onto the substrate surface.

Magnetron sputtering systems use magnetic fields to confine electrons near the target surface, increasing ionization efficiency and deposition rates while enabling precise control over film composition and thickness.

Can Sputtering Systems be integrated with other deposition techniques?

Yes, hybrid systems combining sputtering with other deposition methods such as pulsed laser deposition (PLD) or evaporation can be designed to meet stringent customer requirements. These integrated platforms enable complex multilayer structures and advanced materials synthesis within a single vacuum environment.

What diagnostic tools can be integrated?
Our sputtering chambers feature additional ports for integrating various diagnostic and characterization tools including Residual Gas Analysis (RGA) for monitoring chamber atmosphere, Reflection High-Energy Electron Diffraction (RHEED) for real-time crystal structure analysis, and ellipsometry for in-situ film thickness and optical property measurements. These capabilities enable advanced process control and quality assurance.
What support is available for existing sputtering systems?

PVD Products provides comprehensive support including system upgrades, preventive maintenance, component replacement, and technical consultation. We offer parts and service for PVD Products systems deployed over the past 25+ years. Our global support network ensures responsive service all over the world.

Are PVD Products Sputtering Systems suitable for both R&D and production?

Yes, PVD Products offers systems scaled for different applications from entry level research systems to production-scale platforms. Our modular design approach allows systems to be configured with appropriate throughput, automation, and quality control features matching your current needs with options for future expansion.

What power sources are available for Magnetron Sputtering Systems?

PVD Products offers sputtering systems with multiple power source options including RF (radio frequency), DC (direct current), High Power Impulse Magnetron Sputtering (HiPIMS), and pulsed DC power supplies. These can be configured individually or in combination to optimize deposition parameters for different target materials. Our systems support both conducting and insulating target materials through appropriate power source selection.

What are facing magnetrons and when are they used?

Facing magnetrons are specialized configurations where two magnetron sources are positioned opposite each other with the substrate between them. This setup enables low-energy impact sputtering, which is particularly beneficial for delicate substrate surfaces and temperature-sensitive materials. PVD Products' facing magnetron systems can include multiple rotating heads for computer-controlled multilayer film growth.



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