metal sputtering targets

Sputtering Targets

PVD Products provides sputtering targets for a wide range of applications from ferromagnetic, complex oxides, and semiconducting films. Our standard round target sizes range from 1 inch to 20 inches in diameter, and the rectangular targets are available in lengths up to and over 2000 mm in single or multiple-piece construction, depending on the metal. Metal targets are offered in various purity levels to suit your specific requirements, with the minimum purity of 99.9% up to 99.99% for some metals like aluminum, copper, and molybdenum, and ultra-high purities of 99.995%-99.9995+% for aluminum, tellurium, titanium, cadmium, silicon, and molybdenum.

Target Selection

A wide selection of compound based sputtering targets are available: oxides, nitrides, borides, sulfides, selenides, tellurides, carbides, crystalline and composite mixtures. To achieve the best performance and to prevent the target from cracking or over-heating, we strongly recommend bonding any material target to a backing plate. Target bonding is a critical process, and the exact fabricating method employed can vary depending on the choice of the sputtering target material. A properly bonded sputtering target will normally give a longer working life than a non-bonded target, may enable the use of a higher power input to achieve faster sputtering rates, and will enable thin film process parameters to be consistently repeated. Below is a partial listing of our compound-based sputtering targets. 

Metal Sputtering Targets

Element Symbol
Aluminum Al
Cadmium Cd
Cobalt Co
Europium Eu
Hafnium Hf
Iron Fe
Magnesium Mg
Nickel Ni
Praseodymium Pr
Scandium Sc
Element Symbol
Antimony Sb
Carbon C
Copper Cu
Gadolinium Gd
Holmium Ho
Lanthanum La
Manganese Mn
Niobium Nb
Rhenium Re
Selenium Se
Element Symbol
Bismuth Bi
Cerium Ce
Dysprosium Dy
Germanium Ge
Indium In
Lead Pb
Molybdenum Mo
Palladium Pd
Ruthenium Ru
Silicon Si
Element Symbol
Boron B
Chromium Cr
Erbium Er
Gold Au
Iridium Ir
Lutetium Lu
Neodymium Nd
Platinum Pt
Samarium Sm
Silver Ag

Compound Sputtering Targets

Boride Sputtering Targets
Cr2B, CrB, CrB2, Cr5B3, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, NbB2, TaB,TaB2, TiB2, W2B, WB, VB, VB2, ZrB2
Carbide Sputtering Targets
B4C, Cr3C2, HfC, Mo2C, NbC, SiC, TaC, TiC, TiCN, WC, W2C, WC+Ni,WC+Co, VC, ZrC
Fluoride Sputtering Targets
AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3,MgF2, NdF3, ReF3, SmF3, SrF2, NaF, Cryolite Na3AlF6 , YF3, YbF3
Nitride Sputtering Targets
AlN, BN, GaN, HfN, NbN, Si3N4, TICN, TaN, TiN, VN, ZrN
Oxide Sputtering targets
Al2O3, Sb2O3, ATO ,BaTiO3, Bi2O3, CeO2, Cr-SiO, Cu2O,ITO,CuO, Cr2O3,Dy2O3 ,Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, IGZO, In2O3,ITO, Fe2O3, Fe3O4, LaAl2O3, La2O3, LaSrMnO3, PbO, PbTiO3, PbZrO3,LiNbO3, Lu3Fe5O12, Lu2O3, MgO, MoO3, NiO, Nb2O5, Nd2O3,PZT (PbZrTiO3), Pr6O11, Pr(TiO2)2, Pr2O3, Sm2O3, Sc2O3, SiO2, SiO,SrRuO3, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, ThO2, Tm2O3, TiO2, TiO,Ti3O5, Ti2O3, TiZrO3, SnO2, SnO, WO3, WO2.9, V2O5, YAG, YBCO,Y3Al5O12, Yb2O3, Y2O3, ZnO, AZO, ZnO:Al, ZrO2(unstabilized),ZrO2-5-15 wt% CaO)
Selenide Sputtering Targets
Al2Se3, Sb2Se3, As2Se3, Bi2Se3, CdSe, CuSe, Cu2Se, Ga2Se3, GeSe, In2Se3,PbSe, MoSe2, MnSe, NbSe2, TaSe2, WSe2, ZnSe
Silicide Sputtering Targets
Cr2Si, CrSi2, Co3Si, HfSi2, FeSi2, MoSi2, Mo5Si3, NiSi, NbSi2, Nb5Si3, TaSi2,Ta5Si3, TiSi2, Ti5Si3, WSi2, WS2, V3Si, VSi2, ZrSi2
Sulphide Sputtering Targets
As2S3, AgS, Ag2S, Bi2S3, CuS, Cu2S, Sb2S3, CdS, FeS, GaS, GeS, In2S3,PbS, MoS2, NbS1.75, TaS2, SnS, WS2, ZnS
Tellurides Sputtering Targets
Al2Te3, As2Te3, SbTe, Bi2Te3, CdTe, CuTe, GaTe, Ga2Te3, GeTe, PbTe,MoTe2, NbTe2, As2Te, TaTe2, SnTe, TmTe, WTe2, ZnTe
Antimonide Sputtering Targets
AlSb, CdSb, GaSb, InSb, In2Sb3, NiSb, PbSb, SnSb & ZnSb
Arsenide Sputtering Targets
Cd2As2, GaAs, InAs, PbAs, SnAs, ZnAs2 & Zn2As2

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