PLD 12000 Deposition Systems

Maximum Substrate Size

One 12-inch (300-mm) or smaller diameter substrates.  Multiple small substrates can be accommodated on substrate holders. Custom substrate configurations are available on request.

Maximum Substrate Temperature

900°C (in oxygen) for non-transparent substrates such as silicon, and 800°C for transparent substrates such as sapphire. No thermal paste or bonding required.

Temperature uniformity

±8°C across 12-inch diameter substrate

Operating Pressure Range

5 x 10-7 Torr base to 100 mTorr

Target Size

Custom XYθ four-position 4-inch diameter target manipulator (others available on request)

Film Thickness Uniformity

±5% over 90% of 12-inch diameter substrate

Target to Substrate (Throw) Distance

System designed for 6-inch (~200-mm) throw. Throw is variable from 7.5 inches (minimum) to 9 inches maximum (affects maximum temperature, thickness, and composition specifications)

Raster Path Length

5 inches

Nominal Angle of Incidence

Of the laser beam on target: 60°

Base Pressure of the Main Chamber

P < 5 x 10-7 Torr guaranteed, with system at room temperature without targets. Pressure below 5 x 10-8 Torr with optional load lock.

PLD 12000 Vacuum Chamber

Box-style chamber with easy substrate and target changes

Operational Wavelength

248 nm (KrF). Other wavelengths available on request.

An interior view of a PLD 12000 system with substrate heater, f4-inch diameter XYθ target manipulator and a multi-pocket electron beam evaporation source. The system is mated to a customer supplied robot and 25 wafer FOUP. The software allows programing of the full 25 wafers for continuous unattended depositions.

3-D solid model of PLD 12000 system

Customize A System

Do you know the specifications you need to reach?
Contact us to discuss a custom system.

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