PVD Products has shipped a UHV magnetron sputter deposition system to the NASA Kennedy Space Center this week. The loadlocked system includes three 3-inch in-situ tilting UHV magnetron sputter sources for metal deposition on six inch diameter wafers. Thickness uniformity was +/- 1.5% over a 150 mm diameter wafer. The system is fully computer controlled for multilayer film growth.
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