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Sputter Systems

PVD Products builds complete integrated sputter systems to meet the customer’s specific deposition requirements. These systems' deposition chambers can come with multiple RF and/or DC magnetron sources from 1 inch (25 mm) to 8 inches (200 mm) in diameter.

Performance

This graph shows the film thickness uniformity from a PVD Products sputter deposition system using a 4.5 inch target to substrate distance. This data was obtained by using a 3 inch Titan magnetron with a copper target sputtered onto a rotating oxidized silicon wafer. The film uniformity was measured with a four-point probe and is better than +/- 1.25% over a 4.0 inch diameter circle.

Power Supplies

Magnetron systems with multiple sources can be supplied with single power supplies and switching networks, or with multiple supplies for co-deposition processing. Substrate planetary or rotation stages can include substrate heating to temperatures in excess of 1,000°C with RF or DC Bias.

Ion Sources

Direct ion beam deposition systems using Kaufmann or RF style ion sources can be provided as well. These systems can include ion sources for Ion Beam Assisted Deposition processing as necessary.

Pumping

All the sputtering systems come complete with pumping stations (cryo or turbo pumps depending on system requirements), electro-pneumatic valves, all necessary vacuum gauges, complete power distribution, electronic racks, water and air manifolds, safety interlocks, etc. Vacuum systems can be designed to operate below 10^-9 Torr if necessary.

Operation & Design

Systems can be operated manually, or operate via computer control. Substrate heaters and manipulators can be designed for non-standard substrate shapes and sizes. Load-locks are available for substrates up to 8 inches (200 mm) in diameter.

A combination Magnetron Sputtering/Thermal Evaporation system

3" Titan Magnetron during deposition. Photo courtesy of Mr. Cesare Borgia, ETH Zurich

Please contact us to discuss your specific requirements.