PLD 5000
The PVD Products PLD 5000 is capable of depositing high quality uniform films on
substrates up to 5 inches (125 mm) in diameter. Our systems use a box-style chamber
with a large front-mounted hinged door. This allows for very easy access
to the substrate and target.
System Specifications
Maximum substrate size
Holds one (1) 5-inch diameter substrate, or three 2-inch diameter substrates. Custom
substrate holders available on request.
Maximum substrate temperature
950°C (in oxygen) for non-transparent substrates and 850°C for transparent substrates
(such as LaAlO3 and sapphire). No thermal paste or bonding required.
Temperature uniformity
± 4°C across 5-inch diameter substrate.
Operating Pressure Range
5 x 10-4 Torr base to 300 mTorr.
Target Size
Three 6-inch diameter targets (maximum diameter).
Film Thickness Uniformity
± 5 % over 90% of a 5 inch diameter substrate (6-inch throw) for 500 nm thick films.
Film Characteristics:
Tc > 87 K ± 1 K over 3 inch area for YBCO deposited on LaAlO3
substrates.
Jc > 1.5 MA/cm2 over 3 inch area for YBCO deposited on LaAlO3
substrates.
Film Compositional Uniformity
± 1.5 atomic percent over a 5-inch substrate for most materials such as YBCO using
a 6-inch diameter target and programmable laser beam rastering, and 6” throw. (Uniformity
of materials with high vapor pressures such as Lithium may vary significantly depending
on deposition parameters)
Target to Substrate (Throw) Distance
Variable from 4 inches to 6 inches (effects maximum temperature, thickness and composition
specifications).
Raster path length
5.8 inches
Nominal Angle of Incidence
of the laser beam on target: 60°
Base Pressure of the Main Chamber
P < 5 x 10-7 Torr guaranteed, with system at room temperature without
targets.
Vacuum Chamber
Box style chamber with easy substrate / target changes. The chamber is compatible
with single or multiple magnetron sources as well as ion beam sources.
Operational Wavelength
248 nm (KrF) or 193 nm (ArF)
Please contact us for site prep information.